MediaTek is using Intel's EMIB packaging alongside TSMC's CoWoS for AI ASIC designs, targeting 26% of the AI ASIC market by 2028 amid capacity constraints.
Google has ordered 3 million TPUs from Intel, and Nvidia is actively testing Intel’s 18A process technology, as both ...
SUNNYVALE, Calif., April 23, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close collaboration with TSMC to deliver robust EDA and IP solutions for TSMC's most ...
Cadence Design Systems, Inc. CDNS has announced an expansion of its long-standing collaboration with Taiwan Semiconductor Manufacturing Company (“TSMC”), aimed at accelerating time to silicon for ...
Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...
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