Toppan has addressed a challenge for heterogeneous integration of semiconductors by developing a high-reliability coreless organic interposer1 for next-generation semiconductors with a new product.

To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip‑embedding technology To highlight RF‑SiP substrates that adopt a groundbreaking application of Cu‑Post ...

Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...

LG Innotek will foster its semiconductor substrate business, which has emerged as a key component in the artificial intelligence (AI) era, as a future growth engine. Building on the technological ...

LG Innotek said on the 27th that it will take part in the 2026 Electronic Components Technology Conference (ECTC) and unveil next-generation semiconductor substrate technologies to global ...

CARROLLTON, Tex. — A spin-off of Amkor Technology Inc. in Texas is quietly developing and producing a new class of substrates that could accelerate the development of true system-in-packaging (SIP) ...

LG Innotek said it is working with a North American Big Tech company to develop large semiconductor substrates for artificial intelligence (AI) applications, with the company expecting "tangible ...

LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip ...