As chips become more heterogeneous with more integrated functionality, testing them presents increasing challenges — particularly for high-speed system-on-chip (SoC) designs with limited test pin ...
Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with sufficient yield. “With chiplets, ...
Electronic system designs often include transient protection to ensure system robustness for electrostatic discharge (ESD) events. Adding external ESD protection without compromising system I/O speed, ...
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