DRAM gets a new rival: Tuttle's HBMX ETF takes a broader approach to the AI memory trade

The explosive success of the Roundhill Memory ETF DRAM has turned memory semiconductors into one of the hottest themes in the ...
NextBigFuture

High Bandwidth Memory Will Stack on AI Chips Starting Around 2026 With HBM4

SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...
Tech Times

Samsung 900-Layer NAND Prototype Sets World Record: CMB Technique Doubles Stack Height

Samsung 900-layer NAND prototype — the world’s first — uses Cell Multi-Bonding to fuse two 450-layer wafers into one chip, ...

KSTR ETF: Accessing The Latest Memory Chip IPO

The planned STAR Market IPO is expected to value the company between RMB 300 billion ($42 billion) and RMB 2 trillion ($290 ...
Network World

Micron joins HBM4 race with 36GB 12-high stack, eyes AI and data center dominance

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...
TweakTown

SK hynix CEO announces new vision as Full Stack AI Memory Creator: custom HBM, AI DRAM, AI NAND

TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...
Semiconductor Engineering

Memory On Logic: The Good And Bad

The chip industry is progressing rapidly toward 3D-ICs, but a simpler step has been shown to provide gains equivalent to a whole node advancement — extracting distributed memories and placing them on ...