Abstract: Sparse Bayesian learning (SBL) has become a popular approach for direction-of-arrival (DOA) estimation, but its computational complexity for Bayesian inference is quite high because ...
Abstract: 3D Multi-stacking technology using Cu-Cu hybrid wafer bonding has been developed to achieve superior power, speed performances and higher density with minimized form factor. To realize multi ...
IBM's sub-1-nanometer NanoStack architecture holds almost 100 billion transistors on a chip. These chips are cheaper to run ...
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